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Wafer is a very thin slice of silicon crystal which is used to produce the actual detectors. The production line at VTT can make wafers up to 200 mm in diameter using planar technology. Furthermore, the thickness of the strip detectors is only 150 μm or 300 μm which can be implemented for different bias configurations. Area of the detectors is from 5 x 5 cm2 to 1 x 1 cm2. Interestingly, the modern fabrication techniques such as etching, planarization, lithography and bonding are applied. The most important thing is that leakage currents of the detectors are under few nanoamperes, which makes it acceptable for radiation detection. [2].
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