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Supply voltage (V DD ) from 1.71 V to 3.6 V
Accelerometer operating ranges selectable
±2 g or ±8 g (FXLN83x1Q)
±4 g or ±16 g (FXLN83x2Q)
Low current consumption of 180 μA (typical)
Output Bandwidth Options
High bandwidth, 2.7 kHz (XY axes), 600 Hz (Z axis), (FXLN837XQ)
Low bandwidth, 1.1 kHz (XY axes), 600 Hz (Z axis), (FXLN836XQ)
3 x 3 x 1 mm, 12-pin QFN package (0.65 mm lead pitch)
Robust design with high shock survivability (10,000 g )
Operating temperature from –40 °C to +105 °C
MSL 1 compliant
Interface electronics
The following recommendations are a guide to an effective PCB layout:
- The PCB land should be designed with Non-Solder Mask Defined.
- Signal traces connected to pads should be as symmetric as possible. Dummy traces must be put on the NC pads in order to have same length of exposed trace for all pads.
- No copper traces should be on the top layer of the PCB under the package. This will cause planarity issues with board mount.
Printed Circuit Board Layout and Device Mounting:
Soldering Considerations:
• Stencil thickness should be 100 or 125 μm.
• The PCB should be rated for the multiple lead-free reflow condition with a maximum 260 °C temperature.
• A standard pick-and-place process and equipment shall be used. A Hand soldering process is not recomended.
• A screw-down or stacking to mount the PCB into an enclosure must not be used. These methods could bend the PCB, which would put stress on the package.
Power consumption calculations
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