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Passiiviset komponentit, joihin on printattu elektroniikkaa. Esimerkkejä:

  • Hybrid circuitries: resistors and capacitors
  • Membrane switches: silver traces
  • PCB: Solder mask, etch resist
  • Wafer technology: bumping
  • Printing of resistors on glass – heating etc.
  • Printing of EMC shielding
  • EL lamps

Uutta printtaaminen aktiivisiin komponenteihin

  • Displays
    • EL, EC, and many other, including active backplane components
  • OLEDs
  • Transistors
    • Backplanes for Displays
    • RFID tags and other functionalities
  • Photovoltaics
  • Batteries
  • Sensors

Yleiset materiaalivaatimukset:

  • Stability under ambient conditions
    • Processing and operation
  • Ease of processing
    • Solubility
    • Film forming and orientation
    • Compatibility to other materials
    • Handling, no hazards, ...
  • Scalability
  • Cost

Erityisiä materiaalivaatimuksia:

  • Conductors:
    • Conductivity
  • Semiconductors:
    • Charge carrier mobility, On/off ratio
  • Dielectric:
    • High k, low k; low leakage current, high Vbreak
  • Other functions:
    • Fast switching, high contrast for non-emissive displays
    • High emission efficiency for emissive displays
    • High power conversion rate for photovoltaics
    • High selectivity for sensors
    • Transparent for optical applications
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